Chemical Vapor Deposition (CVD)
- Gas Nature: Flammable and oxidizing process gases such as silane and ammonia.
- Key Features:
- Continuous high-flow operation with large charge volumes.
- Heated systems for thermally sensitive precursors.
- Durable stainless-steel construction with high-purity seals.
- Simplified automation for straightforward process integration.
- Applications: Uniform thin film deposition for dielectrics and conductive layers.
Plasma-Enhanced CVD (PECVD)
- Gas Nature: Flammable, plasma-reactive gases such as silane, ammonia, and hydrocarbons.
- Key Features:
- Operates in pulsed or steady flow modes.
- Dual purge systems for contamination control.
- Mild heating to stabilize reactive gases.
- RF interlocks and gas leak detection integrated for safety.
- Applications: Deposition of dielectric and passivation layers enhanced by plasma activation.
Atomic Layer Deposition (ALD)
- Gas Nature: Pyrophoric and pressure-sensitive gases such as ozone, hydrogen, and ammonia.
- Key Features:
- Ultra-low internal volumes to minimize dead space.
- High-speed pulsed valve timing for atomic-scale film growth.
- Multi-step purge and isolation to prevent cross-contamination.
- Recipe-controlled automation with strict sequencing.
- Applications: Sub-nanometer coating for advanced 3D device architectures.
Etch Gas Boxes
- Gas Nature: Highly toxic and corrosive gases such as chlorine, fluorine-based gases, and oxygen.
- Key Features:
- Rapid flow modulation for precise etching cycles.
- Strong purge and fast divert systems for toxic exhaust handling.
- Corrosion-resistant materials like Hastelloy and PFA linings.
- Built-in sensors, emergency venting, and double containment.
- Applications: Plasma and dry etching of critical semiconductor structures.
Engineering & Testing Capabilities
We provide end-to-end solutions, including:
- P&ID Generation – Complete process and instrumentation diagrams.
- System Layout & Design – Compact, modular, and fab-optimized.
- Custom Manufacturing – Precision orbital welding, UHP cleaning, and assembly.
- System Testing – Helium leak detection, purge validation, and pressure decay testing.
- Component Characterization – Flow dynamics, valve actuation, and material compatibility testing.
Why Our Systems Stand Out
- Process-Specific Optimization – Gas boxes designed for CVD, PECVD, ALD, and Etch needs.
- Safety & Compliance – Built to SEMI S2/S6, CE, and global safety standards.
- High Reliability – Extended component life cycles for long-term performance.
- Future-Ready – Scalable to next-generation wafer sizes and fab requirements.